Publications Repository - Gdańsk University of Technology

Traditional wood-based panels are produced with synthetic, formaldehyde-based adhesives, commonly made from fossil-derived constituents, such as urea, phenol, melamine, etc. Along with their numerous advantages, such as chemical versatility, high reactivity and excellent adhesive performance, these adhesives are characterized by certain problems, connected with the hazardous volatile organic compounds (VOCs), mostly free formaldehyde in the adhesives and the formaldehyde emission from the finished wood composites, which is carcinogenic to humans and harmful to the environment. The growing environmental concerns and stringent legislative requirements to the formaldehyde emission from wood-based panels have posed new challenges to researchers and industrial practice, related to the development of sustainable, eco-friendly wood-based panels with close-to-zero formaldehyde emission. The most common methods to reduce the formaldehyde emission from wood-based panels have been to decrease the free formaldehyde in the adhesive by modifying the adhesive (like lowering the molar ratio of formaldehyde to urea in UF resin) or by using formaldehyde scavengers, one group of scavengers being for adhesives by mixing or reacting and the second one scavengers for wood-based panels as post-treatments. Another way is to use alternative bio-based adhesives, however, there are still substantial challenges for the complete replacement of formaldehyde-based adhesives with bio-based adhesives, mainly because of their relatively low bonding strength, poor water resistance, etc. This article presents a review and analysis of the current state of research in the field of low formaldehyde emission wood adhesives and formaldehyde scavengers for manufacturing low-toxic, eco-friendly wood composites.

Authors

• Lubos Kristak,
• Petar Antov,
• Pavlo Bekhta,
• Muhammad Adly Rahandi Lubis,
• Apri Heri Iswanto,
• Roman Reh,
• Jan Sedliacik,
• Viktor Savov,
• Hamid R. Taghiyari,
• Antonios N. Papadopoulos,
• Antonio Pizzi,
• dr inż. Aleksander Hejna link open in new tab