Publications Repository - Gdańsk University of Technology

Ceramic protective coatings applied to metallic interconnects play a vital role in solid oxide cells (SOCs) preventing interconnect degradation. In this study, uniform, dense, and crack-free single-layer coatings of MnCo2O4, Mn1.7CuFe0.3O4, and dual-layer coatings of MnCo2O4/ Mn1.7CuFe0.3O4 spinel are deposited onto complex-shaped metallic interconnect using electrophoretic deposition (EPD) method. The porosity of sintered MnCo2O4 and Mn1.7CuFe0.3O4 coatings in reduction treatment (1000°C for 2h in H2), followed by subsequent oxidation treatment (900°C for 2h in air) is approximately 50% less than that of these coatings sintered in oxidation treatment (900°C for 4h in air). The results indicate that the thickness of the sintered MnCo2O4, Mn1.7CuFe0.3O4 single-layer, and MnCo2O4/ Mn1.7CuFe0.3O4 dual-layer coatings in reduction + oxidation treatments is 46.2%, 28.2%, and 23.1% denser, respectively, compared to sintered in oxidation treatment. Raman spectroscopy and Energy Dispersive Spectroscopy (EDS) analysis showed that in sintered dual-layer coatings subjected to reduction treatment followed by a subsequent oxidation treatment, exhibit a much more efficient interdiffusion processes throughout the thickness of the coating yielding the formation of a mixed (Mn, Cu, Fe, Co)3O4 spinel, comparing to dual-layer coatings undergoing only oxidation treatment. The dual-layer spinel coatings of MnCo2O4/ Mn1.7CuFe0.3O4 present promising candidate for protective coatings on metallic interconnects.

Authors

• Omid Ekhlasiosgouei link open in new tab ,
• Maciej Bik,
• Sebastian Molin